Repeated measurement of component carrier located in placement area of automatic placement machine

The invention discloses a method for assembling an electronic element for a component carrier. The method comprises the following steps: (a) placing the component carrier in a placement area of an automatic placement machine; (b) fixing the component support in the placement area such that the compo...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: REICHERT LEIF, GRUBER CHRISTOPH, BURDEK BORIS, DEMMEL SYLVESTER
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses a method for assembling an electronic element for a component carrier. The method comprises the following steps: (a) placing the component carrier in a placement area of an automatic placement machine; (b) fixing the component support in the placement area such that the component support occupies a fixed spatial position with respect to the placement machine; (c) detecting a mark attached to the component carrier; (d) determining the position of the detected mark in a coordinate system of the placement machine; (e) placing the component carrier with a first plurality of components taking into account the determined position; (f) re-detecting the mark; (g) re-determining the position of the re-detected marker in the coordinate system; and (h) placing the component carrier with a second plurality of components taking the re-determined position into account. The invention also discloses the automatic placement machine as well as a computer program by means of which the method of assemblin