Gap fill using carbon-based films

Provided herein are methods of filling gaps using high density plasma chemical vapor deposition (HDP CVD). According to various implementations, carbon-containing films such as amorphous carbon and amorphous carbide films are deposited by HDP CVD into gaps on substrates to fill the gaps. The methods...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BART J. VAN SCHRAVENDIJK, KAIHAN ABIDI ASHTIANI, SHU TSAI WANG, WEI TANG, JASON DAEJIN PARK
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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