Organic metal compound-containing gas supply device

[Problem] To provide an organic metal compound supply device that can stably supply an organic metal compound-containing gas stably over a long period of time. [Solution] This supply device (1) of an organic metal compound-containing gas is provided with a container (10), a supply unit (13), and a h...

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Hauptverfasser: HASEGAWA CHIHIRO, YOSHITOMI SUSUMU, TAKEBAYASHI KOUJI, SHIRAI MASASHI
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creator HASEGAWA CHIHIRO
YOSHITOMI SUSUMU
TAKEBAYASHI KOUJI
SHIRAI MASASHI
description [Problem] To provide an organic metal compound supply device that can stably supply an organic metal compound-containing gas stably over a long period of time. [Solution] This supply device (1) of an organic metal compound-containing gas is provided with a container (10), a supply unit (13), and a high-specific gravity object. The container (10) comprises an inner space (10a), a carrier gas inlet (10b) and an exhaust port (10c). The inlet (10b) is connected to the bottom of the inner space (10a). The exhaust port (10c) is connected to the top of the inner space (10a). The supply unit (13) is positioned in the inner space (10a). A mixture of organic metal compound-containing particles and a filler material is arranged in the supply unit (13). The high-specific gravity object is arranged in the inner space (10a), above the supply unit (13). The high-specific gravity object has a specific gravity higher than that of the organic metal compound-containing particles. 本发明提供种能够长时间稳定地供给含有机金属化合物的气体的有机金属化合物的供给装置。含有机金属化合
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[Solution] This supply device (1) of an organic metal compound-containing gas is provided with a container (10), a supply unit (13), and a high-specific gravity object. The container (10) comprises an inner space (10a), a carrier gas inlet (10b) and an exhaust port (10c). The inlet (10b) is connected to the bottom of the inner space (10a). The exhaust port (10c) is connected to the top of the inner space (10a). The supply unit (13) is positioned in the inner space (10a). A mixture of organic metal compound-containing particles and a filler material is arranged in the supply unit (13). The high-specific gravity object is arranged in the inner space (10a), above the supply unit (13). The high-specific gravity object has a specific gravity higher than that of the organic metal compound-containing particles. 本发明提供种能够长时间稳定地供给含有机金属化合物的气体的有机金属化合物的供给装置。含有机金属化合</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20161026&amp;DB=EPODOC&amp;CC=CN&amp;NR=106062244A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20161026&amp;DB=EPODOC&amp;CC=CN&amp;NR=106062244A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HASEGAWA CHIHIRO</creatorcontrib><creatorcontrib>YOSHITOMI SUSUMU</creatorcontrib><creatorcontrib>TAKEBAYASHI KOUJI</creatorcontrib><creatorcontrib>SHIRAI MASASHI</creatorcontrib><title>Organic metal compound-containing gas supply device</title><description>[Problem] To provide an organic metal compound supply device that can stably supply an organic metal compound-containing gas stably over a long period of time. 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[Solution] This supply device (1) of an organic metal compound-containing gas is provided with a container (10), a supply unit (13), and a high-specific gravity object. The container (10) comprises an inner space (10a), a carrier gas inlet (10b) and an exhaust port (10c). The inlet (10b) is connected to the bottom of the inner space (10a). The exhaust port (10c) is connected to the top of the inner space (10a). The supply unit (13) is positioned in the inner space (10a). A mixture of organic metal compound-containing particles and a filler material is arranged in the supply unit (13). The high-specific gravity object is arranged in the inner space (10a), above the supply unit (13). The high-specific gravity object has a specific gravity higher than that of the organic metal compound-containing particles. 本发明提供种能够长时间稳定地供给含有机金属化合物的气体的有机金属化合物的供给装置。含有机金属化合</abstract><oa>free_for_read</oa></addata></record>
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language chi ; eng
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subjects BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SEMICONDUCTOR DEVICES
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
title Organic metal compound-containing gas supply device
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