IC packaging wire bonding short circuit structure and manufacturing method thereof

An IC packaging wire bonding short circuit structure comprises first metal balls which are pre-planted on two metal pads respectively. The two metal balls form wire bonding so as to realize short circuit interconnection. A middle position between the two first metal balls is superposed with a second...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YANG QIANDONG, LU YIPING, SHAO RONGCHANG, LYU DAILIE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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