IC packaging wire bonding short circuit structure and manufacturing method thereof

An IC packaging wire bonding short circuit structure comprises first metal balls which are pre-planted on two metal pads respectively. The two metal balls form wire bonding so as to realize short circuit interconnection. A middle position between the two first metal balls is superposed with a second metal ball. The manufacturing method comprises the following steps that the first step, the two metal pads which need short circuit interconnection are pre-planted with the first metal balls respectively through using a ball-type welding method; the second step, the two metal balls form the wire bonding through using a gold wire or a copper wire or an alloy wire; and the third step, the middle position between the two pre-planted first metal balls is superposed with the second metal ball in an alignment mode. In the invention, a stacked ball short circuit technology is performed on two ball planting points; a technical problem that short wire welding contact is poor is solved and the method is easy to realize; and