Diaphragm bonding tool
The invention provides a diaphragm bonding tool for bonding diaphragms on a substrate. The diaphragm bonding tool comprises a substrate absorbing table, a diaphragm absorbing plate arranged above the substrate absorbing table and capable of moving corresponding to the substrate absorbing table in pa...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a diaphragm bonding tool for bonding diaphragms on a substrate. The diaphragm bonding tool comprises a substrate absorbing table, a diaphragm absorbing plate arranged above the substrate absorbing table and capable of moving corresponding to the substrate absorbing table in parallel, a roller mechanism arranged on the film absorbing plate and positioned at one end of the diaphragm absorbing plate, and a diaphragm positioning mechanism arranged at one end of the diaphragm absorbing plate with the roller mechanism; the roller mechanism and the diaphragm positioning mechanism have a first state and a second state; in the first state, the roller mechanism is hoisted away from the diaphragms, and the diaphragm positioning mechanism is in a first position capable of positioning rolling start ends of the diaphragms on the diaphragm absorbing plate; and in the second state, the diaphragm positioning mechanism is in a second position capable of avoiding from the rolling start ends of the diaphra |
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