Method for welding packaged integrated circuit plate

A package method for automatically welded ball array type of integrated circuit includes defining on surface of polyimide film with copper on single surface to form the first dry membrane, electroplating Cu/Ni/Au/Ni (or Ni/Au, Cu/Ni), removing the first dry membrane, etching on polyimide film to for...

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Bibliographische Detailangaben
1. Verfasser:	WEIREN CAI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A package method for automatically welded ball array type of integrated circuit includes defining on surface of polyimide film with copper on single surface to form the first dry membrane, electroplating Cu/Ni/Au/Ni (or Ni/Au, Cu/Ni), removing the first dry membrane, etching on polyimide film to form holes, electrolytic electroplating the holes to form protruded connecting points, etching thin copper, stripping nickel, and laser drilling to form installing holes and peripheral through holes of chip. Its advantages include fining connecting points, only need of spot welding, and small package area.