Method of adhesion to a polymide surface by formation of covalent bonds

A method of adhesion to a polyimide surface comprises disposing an organic base soln. at a temp. above ambient on the polyimide surface to pretreat the surface by forming aminoester and amide gps. Pref. the organic base soln. is a hydroxylamine soln. which includes 2-(2-aminoethoxy)ethane alcohol or...

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Bibliographische Detailangaben
1. Verfasser:	PROSANTO K. MUKERJI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	A method of adhesion to a polyimide surface comprises disposing an organic base soln. at a temp. above ambient on the polyimide surface to pretreat the surface by forming aminoester and amide gps. Pref. the organic base soln. is a hydroxylamine soln. which includes 2-(2-aminoethoxy)ethane alcohol or 2-(N,N-dimethylamino ethoxy) ethanol. The soln. further includes a solvent of NMP, DMF or gamma -butyrolactone. The encapsulant is an epoxy material.