Non-vertical through-via in package

A package includes a device die, a through-via having a sand timer profile, and a molding material molding the device die and the through-via therein. A top surface of the molding material is substantially level with a top surface of the device die. A dielectric layer overlaps the molding material and the device die. A plurality of redistribution lines (RDLs) extend into the dielectric layer to electrically couple to the device die and the through-via. The invention also provides a non-vertical through-via in the package. 封装件包括器件管芯、具有沙漏轮廓的贯通孔和成型材料，在该成型材料中模制器件管芯和贯通孔，其中成型材料的顶面与器件管芯的顶面基本齐平。介电层覆盖成型材料和器件管芯。多条再分布线(RDL)延伸到介电层中，以电耦接至器件管芯和贯通孔。本发明还提供了封装件中的非垂直贯通孔。