Substrate processing apparatus, and method for manufacturing semiconductor device

The invention relates to a substrate processing apparatus, and a method for manufacturing a semiconductor device. The purpose of the present invention is to provide a substrate processing apparatus and a method for manufacturing a semiconductor device, to achieve a no-stain and uniform cleaning. The...

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1. Verfasser: TATSUSHI UEDA
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention relates to a substrate processing apparatus, and a method for manufacturing a semiconductor device. The purpose of the present invention is to provide a substrate processing apparatus and a method for manufacturing a semiconductor device, to achieve a no-stain and uniform cleaning. The substrate processing apparatus comprises: a process chamber for processing substrates; a substrate loading table disposed in the process chamber for loading a plurality of substrates in a circular manner; a rotary portion for rotating the substrate loading table; a first gas supply portion supplying a first gas atop of the substrate loading table; a second gas supply portion supplying a second gas atop of the substrate loading table; a third gas supply portion supplying a cleaning gas atop of the substrate loading table; and an elevation portion for maintaining the substrate loading table at the substrate processing position when the first gas and second gas are supplied and for maintaining the substrate loading t