Semiconductor packaging component with test structure and test method of semiconductor packaging component

The invention provides a semiconductor packaging component with a test structure and a test method of the semiconductor packaging component. The semiconductor packaging component comprises a substrate, a test chip, a first to-be-tested chip and a second to-be-tested chip, wherein the test chip and the first to-be-tested chip are arranged on the substrate; the second to-be-tested chip is electrically connected to the first to-be-tested chip; and a test vector signal tests the first to-be-tested chip and the second to-be-tested chip through the substrate and the test chip. 种具有测试结构的半导体封装元件及其测试方法。半导体封装元件包括基板、测试用芯片、第待测芯片及第二待测芯片。测试用芯片及第待测芯片设于基板上。第二待测芯片电性连接于第待测芯片。其中，测试向量信号经由基板及测试用芯片测试第待测芯片及第二待测芯片。