Mold for molding expanded resin and process for producing same

A mold for molding an expanded resin, wherein a silicone rubber layer (40) having a JIS-A hardness of 20 to 70 is formed as a heat-insulating layer at least on a part or the whole of the inner wall surface that forms a cavity (20) of a mold main body (10) which is for use in molding an expanded resi...

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Bibliographische Detailangaben
Hauptverfasser: TESHIGAWARA MAMORU, ISHIMOTO RYOTA, SAKAMOTO TAKAFUMI, HAGIWARA TAKASHI, UEYAMA MASATO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:A mold for molding an expanded resin, wherein a silicone rubber layer (40) having a JIS-A hardness of 20 to 70 is formed as a heat-insulating layer at least on a part or the whole of the inner wall surface that forms a cavity (20) of a mold main body (10) which is for use in molding an expanded resin and which is made of an aluminum material. This mold for molding an expanded resin is effectively usable in molding expanded polystyrene or the like by a bead molding method, and can produce a molded product of an expanded resin with high thermal efficiency by virtue of high heat insulation performance. Further, the mold can be easily produced with good execution efficiency. 本发明为在用铝材形成的发泡树脂成型用模具主体(10)的至少形成模腔(20)的内壁面的部分或全部形成有JIS-A硬度为20~70的硅橡胶层(40)作为绝热层的发泡树脂成型用模具。本发明的发泡树脂成型用模具可有效地在采用珠粒成型法的发泡聚苯乙烯等的成型中使用,可绝热性能高、热效率良好地将发泡树脂成型体成型,而且可施工性良好、容易地制造该模具。