Bonding Strategy For Large Area Metal-cladded Ceramic Substrate

The present invention relates to a bonding strategy for a large area metal-cladded ceramic substrate, in particular to a number of variations that may include a device that may include a first substrate having at least one concentrically ground surface; and a second substrate overlying the first substrate in a hexagonally-arrayed print pattern. 本发明涉及用于大面积金属包覆的陶瓷基片的结合策略，更具体地，本发明的些变型实施例可涉及种电子器件；该电子器件可包括具有至少个同心研磨表面的第基片、和采用六边形排列印制图案覆盖第基片的第二基片。