Method Of Manufacturing Semiconductor Device

The present invention aims to provide a method of manufacturing a semiconductor device to thereby provide the semiconductor device with improved reliability. After formation of a first insulating film for an interlayer insulating film by spin coating, the surface of the first insulating film is subj...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: FUKAYA KAZUHIDE, HANAWA TOSHIKAZU
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!