Wafer partition testing method of LED chip

The present invention provides a wafer partition testing method of a LED chip, belonging to the field of the LED production application technology. Each grain of 20-40 circles at the periphery of the chip is subjected to wafer test one by one, and each grain located in the wafer test loop of the chi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Yang Kai, Ma Xiangzhu, Zheng Xiaobo, Xiao Heping, Chen Liang, Zhang Shuangxiang
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!