Peeling device and peeling method for laminated body and method of manufacturing electronic device

The invention relates to a peeling device and a peeling method for a laminated body and a method of manufacturing the electronic device. By means of the peeling device, a first substrate and a second substrate are bonded in a peelable manner to form a laminated body, while the first substrate and the second substrate are sequentially stripped through the interface of the first and second substrates from one ends towards the other ends thereof. The peeling device for the laminated body comprises a bearing part used for bearing the first substrate of the laminated body; a flexible plate used for absorbing the second substrate of the laminated body by means of an absorption surface through the vacuum adsorption process; a movable body bonded to one surface of the flexible plate that is opposite to the absorption surface by means of a connecting member and used for deforming the flexible plate through the movement of the movable body relative to the bearing part so as to sequentially strip the laminated body at t