Peeling device and peeling method for laminated body and method of manufacturing electronic device

The invention relates to a peeling device and a peeling method for a laminated body and a method of manufacturing an electronic device. By means of the peeling device, a first substrate and a second substrate are bonded in a peelable manner to form a laminated body, while the first substrate and the second substrate are sequentially stripped through the interface of the first and second substrates from one ends towards the other ends thereof. The peeling device for the laminated body comprises a bearing part used for bearing the first substrate of the laminated body; a flexible plate used for absorbing the second substrate of the laminated body by means of an absorption surface; and a plurality of movable bodies arranged on one surface of the flexible plate that is opposite to the absorption surface. Meanwhile, the plurality of movable bodies are deformed flexibly from one end to the other end of the flexible plate through moving relative to the bearing part in the mutually independent manner. Therefore, the