THERMOPLASTIC LOW-PROFILE ADDITIVES AND USE THEREOF IN UNSATURATED POLYESTER RESIN COMPOSITIONS

A low-profile additive composition is disclosed which comprises ethylene glycol, at least one nonpolar diol, adipic acid and trimellitic anhydride. The low-profile additive, when included in an unsaturated polyester resin systems, for use in making sheet molding compositions, provides improved proce...

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Bibliographische Detailangaben
Hauptverfasser: ROBERT JOSEPH SCHIAVONE, TIMOTHY WAYNE RAMEY, LOUIS RALPH ROSS
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A low-profile additive composition is disclosed which comprises ethylene glycol, at least one nonpolar diol, adipic acid and trimellitic anhydride. The low-profile additive, when included in an unsaturated polyester resin systems, for use in making sheet molding compositions, provides improved processing characteristics such as viscosity thickening plateau, paste viscosity and phase separation during maturation when the unsaturated polyester.