Stacked inductor-electronic package assembly and technique for manufacturing same

The invention relates to a stacked inductor-electronic package assembly and a technique for manufacturing same. An embodiment of a circuit includes a circuit module and an inductor disposed over and electrically coupled to the module. Disposing the inductor over the module may reduce the area occupied by the circuit as compared to a circuit where the inductor is disposed adjacent to the module, or to a circuit where the inductor is disposed in the module adjacent to other components of the module. Furthermore, disposing the inductor outside of the module may allow one to install or replace the inductor. 本发明涉及种层叠电感器-电子封装组件及其制造技术。电路的个实施例包括电路模块以及布置在模块上并电气耦合于模块的电感器。将电感器布置在模块上可相比电感器布置在模块附近情形的电路或相比电感器布置在模块的其它器件附近的模块内的情形的电路减少电路所占的面积。此外，将电感器布置在模块外侧允许人们安装或更换电感器。