Nozzle and etching apparatus

The invention provides a nozzle and an etching apparatus, belongs to the technical field of etching, and can solve the problem of uneven etching capability caused by a ponding effect in the existing etching process. The nozzle sleeve of each nozzle is connected to the outside of the main body; a liquid outlet is formed in the nozzle sleeve; when the nozzle is in use, a pipeline pumped with an etching liquid is connected with a plurality of the nozzles; the corresponding nozzle sleeve can move relative to the main body, so that the distances from the liquid outlets of the nozzle sleeves at different positions of the substrate to a to-be-etched substrate are correspondingly adjusted equivalently so as to control the outflow volume of the etching liquid and to overcome the ponding effect; and specifically, the distance from the liquid outlet in the middle part of the to-be-etched substrate to the to-be-etched substrate can be adjusted to be less than the distance from the liquid outlet in the edge of the to-be-e