Normal-temperature chromium-free passivation liquid for electroplated copper and passivation technology of normal-temperature chromium-free passivation liquid

The invention provides normal-temperature chromium-free passivation liquid for electroplated copper. The normal-temperature chromium-free passivation liquid for electroplated copper is characterized by comprising benzotriazole (BTA), citric acid, hydrogen peroxide, phosphoric acid and a metal complexing agent, wherein the metal complexing agent is one or two selected from sodium molybdate, potassium fluotitanate, palladium chloride, cobalt nitrate and cerous nitrate. The invention further provides a production technology of performing passivation treatment on the surface of an electroplated copper substrate at normal temperature by using the environmentally friendly chromium-free passivation liquid. Based on an existing passivation production technology, the production technology is combined to the chromium-free passivation liquid provided by the invention to obtain a stable passivation system. A film formed on the surface of an electroplated copper workpiece treated by the passivation liquid is uniform and c