Processing method and processing device for sapphire aperture

Processing method and processing device for sapphire aperture

The invention relates to a processing method and a processing device for sapphire apertures. The processing method for sapphire apertures comprises steps: respectively bonding protection layers on two sides of a sapphire workpiece, placing the bonded sapphire workpiece on a placing base, ensuring th...

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Hauptverfasser: Xia Bishu, Qiu Sibo, Lu Bojun, Li Yong, Xing Wenjie, Yin Guowei, He Cairong
Format: Patent
Sprache:chi ; eng
Schlagworte:
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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creator Xia Bishu
Qiu Sibo
Lu Bojun
Li Yong
Xing Wenjie
Yin Guowei
He Cairong
description The invention relates to a processing method and a processing device for sapphire apertures. The processing method for sapphire apertures comprises steps: respectively bonding protection layers on two sides of a sapphire workpiece, placing the bonded sapphire workpiece on a placing base, ensuring the sapphire workpiece to be vertical to a processing tool; starting an ultrasound device, adjusting ultrasonic frequency to a preset range; spraying a grinding liquid to the surface of the sapphire workpiece; prepressing the processing tool on the surface of the sapphire workpiece to preset depth, after that, driven by the ultrasound device, completing a machining process of an aperture; taking down the sapphire workpiece which is bonded with the protection layers, using a cleaning fluid to soak to make the sapphire workpiece and the protection layers separate, and cleaning the surface of the sapphire workpiece. The method uses an ultrasonic machining method to process sapphire apertures, greatly reduces processing
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The processing method for sapphire apertures comprises steps: respectively bonding protection layers on two sides of a sapphire workpiece, placing the bonded sapphire workpiece on a placing base, ensuring the sapphire workpiece to be vertical to a processing tool; starting an ultrasound device, adjusting ultrasonic frequency to a preset range; spraying a grinding liquid to the surface of the sapphire workpiece; prepressing the processing tool on the surface of the sapphire workpiece to preset depth, after that, driven by the ultrasound device, completing a machining process of an aperture; taking down the sapphire workpiece which is bonded with the protection layers, using a cleaning fluid to soak to make the sapphire workpiece and the protection layers separate, and cleaning the surface of the sapphire workpiece. 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subjects DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
title Processing method and processing device for sapphire aperture
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