Processing method and processing device for sapphire aperture
The invention relates to a processing method and a processing device for sapphire apertures. The processing method for sapphire apertures comprises steps: respectively bonding protection layers on two sides of a sapphire workpiece, placing the bonded sapphire workpiece on a placing base, ensuring th...
Gespeichert in:
Hauptverfasser: | , , , , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention relates to a processing method and a processing device for sapphire apertures. The processing method for sapphire apertures comprises steps: respectively bonding protection layers on two sides of a sapphire workpiece, placing the bonded sapphire workpiece on a placing base, ensuring the sapphire workpiece to be vertical to a processing tool; starting an ultrasound device, adjusting ultrasonic frequency to a preset range; spraying a grinding liquid to the surface of the sapphire workpiece; prepressing the processing tool on the surface of the sapphire workpiece to preset depth, after that, driven by the ultrasound device, completing a machining process of an aperture; taking down the sapphire workpiece which is bonded with the protection layers, using a cleaning fluid to soak to make the sapphire workpiece and the protection layers separate, and cleaning the surface of the sapphire workpiece. The method uses an ultrasonic machining method to process sapphire apertures, greatly reduces processing |
---|