Light emitting device package

A packaged light emitting device die (20) includes a package body having a profiled leadframe (10) embedded in a body (12) of reflecting material. The leadframe (10) is exposed on mounting surface (14) only on at least one solder bonding area (16). Solder (22) is present only on the at least one solder bonding area (16) and not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe (10). Moreover, the reflecting material can function as a solder resist to self-align the solder (22) to the at least one solder bonding area (16). 种经封装的发光器件管芯（20）包括具有嵌入在反射材料主体（12）中的轮廓化引线框架（10）的封装主体。引线框架（10）仅在至少个焊料键合区域（16）上暴露于安装表面（14）上。焊料（22）仅存在于至少个焊料键合区域（16）上而不在其它地方。反射材料提供封装的反射部分，因此不存在对于沉积在引线框架（10）上的反射层的需要。而且，反射材料可以充当焊料抵挡部以将焊料（22）自对准到至少个焊料键合区域（16）。