Photocurable composition and method for manufacturing electronic component

The invention discloses a photocurable composition and a method for manufacturing an electronic component. Provided is a photocurable composition whereby adhesion of a cured film thereof to a member to which the composition is applied can be increased, the light reflectance of the cured film can be increased, due to the cured film being white, and the heat resistance of the cured film can be increased. The photocurable composition pertaining to this invention is applied partially and in a plurality of locations on the surface of a member to which the composition is applied, and includes: an epoxy (meth)acrylate not having a carboxyl group and having a weight-average molecular weight of 2000 or greater; a photocurable compound which is not an epoxy (meth)acrylate having a weight-average molecular weight of 2000 or greater, does not have a weight-average molecular weight of 2000 or greater, and has at least one ethylenically unsaturated bond; a white pigment; and a photopolymerization initiator; the content of