Cooling system used for computer server frame
The invention discloses a cooling system used for a computer server frame. The cooling system comprises a first liquid cooling system and a second liquid cooling system used for a first server module. The first liquid cooling system comprises a first cold plate configured to be in thermal coupling w...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a cooling system used for a computer server frame. The cooling system comprises a first liquid cooling system and a second liquid cooling system used for a first server module. The first liquid cooling system comprises a first cold plate configured to be in thermal coupling with any part, generating heat, of a first server module; a first hot plate; and a plurality of first guide tubes which are used for circulating a first liquid refrigerant through the first cold plate and the first hot plate. The second liquid cooling system comprises a second cold plate in thermal coupling with the first hot plate; a cooling unit; and a plurality of second guide tubes which are used for circulating a second liquid refrigerant through the second cold plate and the cooling unit. The cooling unit is used for transmitting heat from the server module to the position outside a room containing the computer server frame.
公开了种用于计算机服务器机架的冷却系统。该冷却系统包括:用于第服务器模块的第液体冷却系统和第二液体冷却系统。该第液体冷却系统包括:第冷板,其被设置为与所述第服务器模块的任何 |
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