Chip positioning device and chip positioning method

The invention discloses a chip positioning device and a chip positioning method. The chip positioning device is used for end encapsulation positioning of the chips of inverted type multi-layer ceramic capacitors. The chip positioning device includes a first guide plate with a plurality of uniformly-arranged first through holes, a second guide plate with a plurality of uniformly-arranged second through holes, and a positioning plate with a plurality of uniformly-arranged third through holes; the length and width of the first through holes are matched with the length and thickness of the chips; the number and distribution positions of the second through holes are matched with the number and distribution positions of the first through holes; the width of the second through holes is equal to the width of the first through holes; the depth of the second through holes is larger than the width of the chips; the number and the distribution positions of the third through holes are matched with the number and the distr