Method for recovering tin from circuit board waste
The invention proposes a method for recovering tin from a circuit board waste. The method comprises the following steps: 1) pretreatment of the circuit board waste: a device on the circuit board waste is dismounted; and a dismounted circuit board is reacted with diluted hydrochloric acid; 2) tin dis...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention proposes a method for recovering tin from a circuit board waste. The method comprises the following steps: 1) pretreatment of the circuit board waste: a device on the circuit board waste is dismounted; and a dismounted circuit board is reacted with diluted hydrochloric acid; 2) tin dissolving: the circuit board reacted with the diluted hydrochloric acid in the step 1) is put in a leaching tank containing SnCl4 solution for dissolving and filtering; and filtrate is tin-contained solution; and 3) treatment of the tin-contained solution: the tin-contained solution obtained in the step 2) is extracted to a diaphragm electrolytic bath for diaphragm electrodeposition to deposit simple-substance tin on a cathode, wherein the diaphragm electrodeposition has the following parameter conditions: the current density is 300-800 A/m2, the temperature is 20-50 DEG C, and the electrode gap is 6-10 cm. The method can efficiently recover tin from the circuit board waste; and generated solution tin can be recycled |
---|