Heat dissipation device and method of dissipating heat

The present invention discloses a heat dissipation device and a method of dissipating heat. The heat dissipation device includes: a plurality of heat receiving members disposed on a plurality of electronic components mounted on a substrate; a plurality of heat pipes fixed to the respective heat receiving members; and a heat sink mounted on the substrate and includes a plurality of openings formed corresponding to the heat pipes, wherein the heat pipes are inserted in the respective openings, and an inner diameter of the openings in a perpendicular direction to a surface of the substrate is larger than a diameter of the heat pipes in the perpendicular direction to the surface of the substrate. 本发明公开了种散热装置和散热方法。该散热装置包括：多个热接收构件，被布置在安装于基板上的多个电子部件上；多个热导管，被固定至相应热接收构件；以及散热器，被安装于基板上并且包括对应于热导管形成的多个开口，其中，热导管被插入相应开口中，并且在与基板的表面垂直的方向上的开口的内径大于在与基板的表面垂直的方向上的热导管的直径。