Flexible electronic device

The invention discloses a flexible electronic device. The electronic device comprises a flexible substrate, at least a component, and at least a stress buffer. The component is configured on the flexible substrate and is provided with a side surface. The stress buffer is adjacent to the side surface...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	GUO SHUWEI, CAI ZHENZHU, WU ZHENGZHE, LUO GUOLONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The invention discloses a flexible electronic device. The electronic device comprises a flexible substrate, at least a component, and at least a stress buffer. The component is configured on the flexible substrate and is provided with a side surface. The stress buffer is adjacent to the side surface of the component, and has gradually increased rigidity toward a component direction. 本发明公开种软性电子装置。上述电子装置包括软性基板、至少构件以及至少应力缓冲物。构件配置于软性基板上，且具有侧表面。应力缓冲物邻近于构件的侧表面，且朝构件方向具有逐渐增大的刚性。