Method for manufacturing ceramic part with closed cavity structure for high-frequency high-speed ceramic package shell

The invention discloses a method for manufacturing a ceramic part with a closed cavity structure for a high-frequency high-speed ceramic package shell, and relates to the technical field of preparation of semiconductor microelectronic devices. The method comprises the following steps: preparing a gr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BAI HONGBO, REN CAIHUA, CHEN JUNWEI, ZHANG YIZHENG, DING FEI, WU YAGUANG, LIU LINJIE, ZHENG XIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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