Method for manufacturing ceramic part with closed cavity structure for high-frequency high-speed ceramic package shell

The invention discloses a method for manufacturing a ceramic part with a closed cavity structure for a high-frequency high-speed ceramic package shell, and relates to the technical field of preparation of semiconductor microelectronic devices. The method comprises the following steps: preparing a green tape material; slotting holes at positions where slotting is required and a cavity needs to be formed on the cut green tape material by adopting slotting equipment, and forming the cavity; printing necessary metallization patterns on corresponding positions of a surface and a side wall of a green ceramic piece by adopting a screen printing method; filling a sacrificial material in the formed cavity; carrying out a lamination treatment on the overlapped green ceramic piece, and adjusting and controlling the density among layers and the shape of the cavity by process parameters; sintering a prepared green ceramic part to prepare the ceramic part with the closed cavity structure, wherein in a sintering process of