Heat-cured conductive paste composition

Provided is a heat-cured conductive paste composition having superior storage stability by preventing a decrease in conductivity or an increase in viscosity due to storage, even if copper, a copper alloy, a silver-coated copper that is copper coated by silver, or a coated copper alloy that is a copper alloy coated by silver is used as a conductive powder. The heat-cured conductive paste composition contains (A) a conductive powder, (B) a heat-cured resin, (C) a curing agent, and (D) an inorganic ion exchange body, wherein at least one selected from the group consisting of copper, a copper alloy, a silver-coated copper, or a silver-coated copper alloy is used as (A) the conductive powder, and a blocked polyisocyanate compound or a blocked polyisocyanate compound and an epoxy resin are contained as (B) the heat-cured resin. 本发明提供种即使在采用铜、铜合金、银包覆铜得到的银包铜、或银包覆铜合金得到的银包铜合金作为导电性粉末的情况下，也可防止保存造成的粘度增大和导电性降低、具有优异的保存稳定性的热固化型导电浆料组成物。本发明提供种热固化型导电浆料组成物，是含有（A）导电性粉末、（B）热固化型树脂、（C）固化剂和（D）无机离子交换体的热固化型导电浆料组成物；（A）导电性粉末采用从由铜、铜合金、银包铜和