Cutting type multi-circle QFN/DFN packaging part and manufacturing method thereof

The invention discloses a cutting type multi-circle QFN/DFN packaging part and a manufacturing method thereof. The packaging part mainly comprises a multi-circle framework, a silvered layer, a chip, a welding wire, a plastic-sealed body and a tinned layer, wherein the tinned layer is arranged at the lower portion of the multi-circle framework, a cutting groove is in the multi-circle framework in the side direction of the tinned layer, and the cutting groove and a groove are communicated. The method comprises steps of chip mounting, pressure welding, plastic packaging, electroplating and half cutting. The packaging part has advantages of low cost and low pollution. 本发明公开了种切割式多圈QFN/DFN封装件及其制造方法，所述封装件主要由多圈框架、镀银层、芯片、焊线、塑封体和镀锡层组成；所述多圈框架下部有镀锡层，从镀锡层侧向多圈框架内部有切割槽，切割槽与凹槽贯通。所述方法如下：上芯、压焊、塑封、电镀、半切割。本发明具有成本低、污染小的特点。