Electronic Component Manufacturing Apparatus And Electronic Component Manufacturing Method

The invention provides an electronic component manufacturing method including a step of reliably turning the electronic component chips to certain rotation degrees required even if the electronic component being small in size is propelled. The electronic component manufacturing method includes the steps of preparing at least one electronic component chip (1) having a first surface and a second surface opposite each other; holding the electronic component chip (1) between a first plate and a second plate such that the first surface is in contact with a first elastic layer (14) of the first plate and the second surface is in contact with a second elastic layer (17) of the second plate; and turning the electronic component chip (1) by relatively moving the first and second plates (12, 15) in a planar direction thereof using a planar movement mechanism (19) and moving the first and second plates (12, 15) in accordance with a turning path of the electronic component chip (1) using the planar movement mechanism (19