Pull-out test device and measuring calibration method for measuring bonding strength of micro-diameter material reinforced soil
The invention relates to a pull-out test device for measuring bonding strength of micro-diameter material reinforced soil. The pull-out test device is characterized by comprising a soil-accommodating unit, a clamping unit and a tensile force control unit, wherein the soil-accommodating unit and the...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a pull-out test device for measuring bonding strength of micro-diameter material reinforced soil. The pull-out test device is characterized by comprising a soil-accommodating unit, a clamping unit and a tensile force control unit, wherein the soil-accommodating unit and the tensile force control unit are fixedly arranged on a test platform along horizontal direction; the clamping unit is connected with the soil-accommodating unit and the tensile force control unit through a pull rope with a small end opening fixed; the soil-accommodating unit comprises a steel plate and a square accommodating box; the square accommodating box is composed of five steel plates; a groove is formed in the square accommodating box and can be used for changing the scope of soil filling and the distance between the fixed steel plates; a small hole is formed in the middle part of the right side of the square accommodating box, and a test material can penetrate out of soil from the small hole. The pull-out tes |
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