Missile-borne high-speed backplane based on VPX standard

The invention discloses a missile-borne high-speed backplane based on a VPX standard. The backplane comprises a PCB provided with a signal layer, a power layer and a plane layer; a first power connector and a second power connector which are used for providing power input of an external power system...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: JIN HAOXIN
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses a missile-borne high-speed backplane based on a VPX standard. The backplane comprises a PCB provided with a signal layer, a power layer and a plane layer; a first power connector and a second power connector which are used for providing power input of an external power system are fixed to the PCB; a plurality of module groove positions are further fixed to the PCB; the intervals between the module groove positions are 25.4 mm of the VPX standard; and the module groove positions are in communication with an external device through a reinforced mixed installation type electric connector. The scheme has the beneficial effects that the assembly complexity is low, signal transmission is high in speed and stable, extending and upgrading are easy and convenient, reliability is high, and cost is low, and is applicable to missiles designed to be integrated, universal and small. 本发明公开了种基于VPX标准的弹载高速背板,该背板包括具有信号层、电源层和平面层的PCB电路板;该PCB电路板上固定有用于提供外部电源系统的电源输入的第电源连接器和第二电源连接器;该PCB电路板上还固定有多个模块槽位,各模块槽位之间的间