side magnet frame and magnetron sputtering equipment

The invention provides a side magnet frame and magnetron sputtering equipment. The side magnet frame is arranged on one side of the side wall of a reaction cavity in a surrounding manner and located at the position close to a lower electrode used for bearing a chip. The side magnet frame comprises an annular supporting piece, and a plurality of installation assemblies arranged in the circumferential direction of the annular supporting piece at intervals are arranged on the annular supporting piece; and all installation assemblies are used for selectively fixing side magnets to different positions of the annular supporting piece in the radial direction. According to the side magnet frame, the magnetic field intensity of magnetic fields generated by the side magnets in the reaction cavity can be flexibly adjusted according to different process requirements, and the process homogeneity can be improved accordingly. 本发明提供种边磁铁框架及磁控溅射设备，其环绕设置在反应腔室的侧壁侧，且位于靠近用于承载晶片的下电极的位置处，该边磁铁框架包括环形支撑件，在该环形支撑件上设置有沿其周向间隔设置的多个安装组件，每个安装