Supporting Unit And Substrate Treating Apparatus Including The Same

A fabrication method of a supporting unit supporting a substrate is provided. The fabrication method includes providing a supporting plate that is made of a non-conductive material and configured to support the substrate, providing a base plate that is disposed under the supporting plate and made of...

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Bibliographische Detailangaben
Hauptverfasser:	LEE, WON HAENG, HA, KANG RAE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CONVERSION OR DISTRIBUTION OF ELECTRIC POWER CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS GENERATION LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A fabrication method of a supporting unit supporting a substrate is provided. The fabrication method includes providing a supporting plate that is made of a non-conductive material and configured to support the substrate, providing a base plate that is disposed under the supporting plate and made of a material containing a conductive material, and forming a first metal film on a top surface of the base plate and bonding the supporting plate with the base plate through a brazing process. 提供了支承衬底的支承装置的制造方法。所述制造方法包括：提供由非传导材料制成并被构造成支承衬底的支承板，提供布置在所述支承板之下并由含有传导材料的材料制成的底板，和在所述底板的顶表面上形成第金属膜并通过钎焊工艺将所述支承板与所述底板接合。