Quartz wafer processing technology

The invention is applicable to the field of electronic component processing technologies and provides a quartz wafer processing technology. The technology comprises the following steps: covering a film, namely coating a middle area of a quartz wafer with a protective material; processing, namely arranging the quartz wafer, abrasive sand, a steel ball and water in a roller, and starting the roller to rotate, thereby finishing processing; and removing the film, namely removing the protective material on the quartz wafer. According to the technology disclosed by the invention, the processing period of the quartz wafer is shortened, the production cost is reduced, and the performance of the quartz wafer is not influenced. In addition, the processing technology disclosed by the invention is easy to operate and convenient for industrial production. 本发明适用于电子元件加工工艺领域，提供了种石英晶片加工工艺，包括以下步骤：覆膜：将石英晶片的中间区域涂覆上保护材料；加工：将石英晶片、研磨砂、钢珠和水置于滚筒内,启动滚筒转动，完成加工；脱膜：去除石英晶片上的保护材料。本发明不仅缩短了石英晶片加工周期、降低了生产成本，而且不影响石英晶片的性能。此外，本发明的加工工艺操作简单，便于工业化生