Process for corrosion protection of copper and copper alloys

PCT No. PCT/GB95/02912 Sec. 371 Date Aug. 28, 1997 Sec. 102(e) Date Aug. 28, 1997 PCT Filed Dec. 13, 1995 PCT Pub. No. WO96/20295 PCT Pub. Date Jul. 4, 1996A process for the corrosion protection of copper or copper alloy which process comprises contacting the surface with an aqueous solution of at l...

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Hauptverfasser:	A. M. SOUTAR, K. W. P. WHITE, J. REYNOLDS
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PRINTED CIRCUITS
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Zusammenfassung:	PCT No. PCT/GB95/02912 Sec. 371 Date Aug. 28, 1997 Sec. 102(e) Date Aug. 28, 1997 PCT Filed Dec. 13, 1995 PCT Pub. No. WO96/20295 PCT Pub. Date Jul. 4, 1996A process for the corrosion protection of copper or copper alloy which process comprises contacting the surface with an aqueous solution of at least one compound of general formula (I), wherein X is N, Y is CR and Z is N, or X is N, Y is N and Z is N or CR or X is CR, Y is N and Z is N, where R is a hydrogen atom or R1, and R1 is an alkyl, aryl, aralkyl, halogen, trihalomethyl, amino, heterocyclic, NHR2, NR3R4, CN, CO2H, CO2R5, OH or OR6 group, where each of R2 to R6 independently represents an alkyl, aryl, or aralkyl group.