Single-face electroplating device and electroplating process thereof

The invention discloses a single-face electroplating device and an electroplating process thereof, and relates to the technical field of electrochemical silver plating. The single-face electroplating device is technically characterized in that the single-face electroplating device comprises an elect...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WU CUNZHEN, CHEN JIANDAO
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!