Single-face electroplating device and electroplating process thereof

The invention discloses a single-face electroplating device and an electroplating process thereof, and relates to the technical field of electrochemical silver plating. The single-face electroplating device is technically characterized in that the single-face electroplating device comprises an electroplating bath used for accommodating electroplating liquid and further comprises a rotating shaft, a first guiding shaft, a second guiding shaft and a fixing frame, wherein the rotating shaft, the first guiding shaft, the second guiding shaft and the fixing frame are used for isolating a face which does not need to be electroplated; the electroplating bath is fixedly arranged on the fixing frame, the rotating shaft is rotatably connected to a bath opening of the electroplating bath, the first guiding shaft is rotatably fixed to the fixing frame and located at the left side of the rotating shaft, and the second guiding shaft is rotatably fixed to the fixing frame and located at the right side of the rotating shaft;