Conductor molding device and method
The invention provides a conductor molding device and method. A coil-end molding device (20) includes a first molding die (21) and a second molding die (22) which approach each other along an X-direction and mold an edgewise bend part and a flatwise bend part on a lead wire part (11), and a third mo...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a conductor molding device and method. A coil-end molding device (20) includes a first molding die (21) and a second molding die (22) which approach each other along an X-direction and mold an edgewise bend part and a flatwise bend part on a lead wire part (11), and a third molding die (23) which approaches the second molding die (22) along the X-direction and molds an edgewise bend part in coordination with the second molding die (22) on a loose end section of the lead wire part (11). The second molding die (22) is configured so as to be capable of moving towards and away from the first molding die (21) along a Y-direction which differs from the X-direction, and the third molding die (23) is configured so as to be capable of moving towards and away from the second molding die (22) along the Y-direction which differs from the X-direction.
本发明提供种线圈末端成形装置,线圈末端成形装置(20)包括:第成型模(21)以及第二成型模(22),它们沿着X方向相互接近而在引线部(11)成形沿边弯曲部以及平直弯曲部;以及第三成型模(23),其沿着X方向相对于第二成型模(22)接近并且与该第二成型模(22)协作而在引线部(11)的自由端部成形沿边 |
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