Sealing material and sealing structure using same

The invention discloses a sealing material and a sealing structure using same. The sealing material (10) comprises a resin ring (11) and an elastic ring (12). The resin ring (11) is formed of a resin composition which contains a polyamide resin and a polyolefin resin and has a melt flow rate of 1-50...

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Bibliographische Detailangaben
Hauptverfasser:	MINAMISHIMA MISA, KANOU YASUJI, MATSUURA KIMITERU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BLASTING CHEMISTRY CYLINDERS DYES ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING LIGHTING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE MECHANICAL ENGINEERING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PISTONS POLISHES SEALINGS THERMAL INSULATION IN GENERAL WEAPONS
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Beschreibung
Zusammenfassung:	The invention discloses a sealing material and a sealing structure using same. The sealing material (10) comprises a resin ring (11) and an elastic ring (12). The resin ring (11) is formed of a resin composition which contains a polyamide resin and a polyolefin resin and has a melt flow rate of 1-50 g/10min as measured at a temperature of 230 DEG C under a load of 21.18 N in accordance with JIS K7210. 密封件(10)具有树脂环(11)和弹性环(12)。树脂环(11)由含有聚酰胺树脂和聚烯烃树脂且按照日本工业标准K7210在温度230℃和负荷21.18牛顿的条件下测量的熔体流速为1～50g/10min的树脂组合物形成。