Bonding clip, carrier and method of manufacturing a bonding clip

The invention relates to a bonding clip, a carrier and a method of manufacturing a bonding clip. Various embodiments provide a clip for clip bonding of a die to a carrier (bonding clip), wherein the clip comprises a clip body comprising a first region configured to be fixed on a carrier and a second region configured to be fixed to a die, wherein at least one of the first region and the second region comprises a guiding structure configured to guide the clip when connecting the carrier and the die. 本发明涉及接合夹具、载体和制造接合夹具的方法。各种实施例提供用于管芯到载体的夹具接合的夹具（接合夹具），其中所述夹具包括了包括被配置为被固定在载体上的第区以及被配置为被固定到管芯的第二区的夹具本体，其中所述第区和所述第二区中的至少个包括被配置为当连接载体和管芯时引导所述夹具的引导结构。