Method and system for tensile test of wire bonding

A method for tensile test of wire bonding is disclosed and includes the steps of: (i), manufacutring first bongding at a first position on a bonding surface including a conductive mateiral by bonding an end of the wire through a wire bonding tool, thereby completing the circuit; (ii) clamping the wire by a wire clamp; (iii) tensioning the wire through the wire clamp to apply a preset tensile force; (iv) detecting whether the circuit is cut; and (v) if the circuit is cut, determining that the bonding is failure, and automatically counting bonding failure increase. 公开了种导线键合的拉伸测试的方法，所述方法包括以下步骤：(i)通过导线键合工具，键合导线的末端以在包括传导材料的键合表面上的第位置处制造第键合，从而所述键合完成电路；(ii)通过导线夹夹住所述导线；(iii)通过所述导线夹拉伸所述导线以施加预先确定的拉伸力；(iv)检测所述电路是否断开；以及(v)如果所述电路是断开的，则确定存在键合失败，并且自动递增键合失败计数。