Method for achieving high-temperature application performance of LED lamp metal base through low-temperature welding
The invention discloses a method for achieving the high-temperature application performance of an LED lamp metal base through low-temperature welding and relates to a low-temperature welding method for the LED lamp metal base. The method aims to solve the problems that chips are burnt and the weldin...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a method for achieving the high-temperature application performance of an LED lamp metal base through low-temperature welding and relates to a low-temperature welding method for the LED lamp metal base. The method aims to solve the problems that chips are burnt and the welding temperature is high caused by low production efficiency and slow heat transferring and consequentially the overall service life of LED lamps is short through existing welding of LED lamp metal bases. The method comprises the steps that firstly, a to-be-welded part is prepared; secondly, the to-be-welded part is preheated; thirdly, primary brazing is conducted to obtain a welding face; and fourthly, ultrasonic vibration welding is conducted and the method for achieving the high-temperature application performance of the LED lamp metal base through low-temperature welding is completed. The welding temperature of the method is lowered from the peak temperature of 260 DEG C of reflow welding in the prior art to 110 D |
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