Bonding strength test method

The invention relates to a bonding strength test method. The method comprises preparing a thin film or thick film circuit the same to a product to be detected, processing a blind slot between two bonding pads of the thin film or thick film circuit, bonding an interconnected lead or beam lead device...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU JIANJING, MO XIUYING, SUN JIANHUA, WANG BIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING
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