Bonding strength test method

The invention relates to a bonding strength test method. The method comprises preparing a thin film or thick film circuit the same to a product to be detected, processing a blind slot between two bonding pads of the thin film or thick film circuit, bonding an interconnected lead or beam lead device to be detected to the bonding pads of the thin film or thick film circuit, wherein bonding points are corresponding pads at two sides of the blind slot, putting the bonded pads on a wafer bearing table of a tensile test device, making a test drag hook pass through the bottom of the interconnected lead or beam lead device to be detected through the blind slot, then fixing the test drag hook to the interconnected lead or beam lead device to be detected, carrying out nondestructive and destructive bonding strength tests and recording data so that a bonding strength test is finished. The bonding strength test method realizes a nondestructive test on an interconnected lead and device without change of a bonding method,